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Japan develops PA film withstanding high temperature
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Japan develops PA film withstanding high temperature
On 17 Feb., 2014, it's announced that Japan Advanced Institute of Science and Technology and University of Tsukuba, based on E.coli, jointly developed a polyamide (PA) film. It can withstand the highest temperature of 400℃. It is disclosed by the R&D...
Biomaterials China News 201402
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